CIS-XADL-LW01

可扩展式工控机, 搭载高性能 CPU 平台, 通过扩展适用于机器视觉、运动控制等各种工业用例场景。

系统 Ssytem
• Intel® 12th/13th/14th Core™/Pentium®/ Celeron® (TDP up to 65W)
• LGA 1700, Q670 Chipset
• 2x DDR5, Max to 96GB
外部接口 External I/O
• 6x RJ45, 6x COM
• 1x VGA, HDMI and DP++ Display
• 1x Line-out, 1x Mic-in, optional
• 8x USB 3.2 (Gen 2)
• 16Bit Isolated DIO
内部接口 Internal I/O
• 2x USB 2.0 Type-A
• 3x SATA 3.0, 3x SATA Power
• 1x TPM 2.0 pin header
• 2x PCIE x16, 2x PCIE x4

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系统
Processor	Intel® 12th/13th/14th Generation Core™/Pentium®/Celeron® LGA 1700 Socket Processors with TDP up to 65W
Chipset	Intel® Q670 Chipset
Memory	2x DDR5 3200/4800Mhz SO-DIMM, Max Up to 96GB
Graphics	AMI 256Mbit SPI Flash
OS	Windows 10/11 64bit, Linux
Watchdog Timer	System reset, programmable 255 levels timer interval, from 1~255 sec/min

外部接口 External I/O
Interface	6x RJ45: 1x RJ45 Intel® I219-V GbE（10/100/1000 Mbps） 5x RJ45 Intel® I210-AT GbE（10/100/1000 Mbps）
Display	1x DP++ max resolution up to 4096 x 2304@60Hz 1x HDMI: max resolution up to 4096 x 2160@30Hz 1x VGA: max resolution up to 1920 x 1200@60Hz Support 三屏异显
Audio	1x Line-out, 1 x MIC,选配, 默认不上件
COM	6x COM： COM1～2（RS232/422/485), TX/RX 隔离等级: 2KV DC/AC COM 3～6（RS232 TX RX GND）
USB	8x USB 3.2（Gen2）
DIO	16Bit Isolated DIO；8x DI, 8x DO Default DI 湿节点输入, DO: NPN漏型输出隔离等级：DI/DO: 2KV DC/AC 电压范围：高电平：18~36V, 低电平：0~5V 驱动能力：≤350mA 响应频率：≤1KHz
Botton	1x Power button w/LED 1x Clear CMOS Button 1x OS Recovery Button
LED	1x HDD LED 1x COM1 TX1 LED 1x COM1 RX1 LED 1x COM2 TX2 LED 1x COM2 RX2 LED 1x 用户自定义 LED
Remote	1 x Remote ON-OFF

内部接口 Internal I/O
Expansion Slot	1x Full-size Mini-PCIe Slot for 4G module（PCIe + USB） 1x M.2 2280 slot for SSD（SATA3.0+Nvme） 1x M.2 2280 slot for SSD（Only Nvme）Default 1x M.2 2230 slot for Wifi module Support CNVi 1x M.2 3042/3052 for 5G module 双 NVME, 支持 Raid 0, 1
USB	2x USB2.0 Type-A
SATA	3x SATA 3.0, 3x SATA Power, 选配支持 Raid 0, 1, 5
FAN	1x CPU Smart Fan 2x System Smart Fan (标准款无 Smart Fan，两槽以上扩展标配 Smart Fan)
SIM	1x Stander SIM Card Slot
Switch	1x AT /ATX Switch 1x USB Power S0/S5 Switch
TPM	1x TPM 2.0 pin header
扩展插槽	1x 异形扩展槽, 由 PCIe x16+PCIe x8 组成, 用来扩展各种扩展插槽

可扩展卡 Expansion Card
2 Slots	EB.RXBX.2PC1: 2x PCI EB.RXBX.2CE1: 1x PCI + 1x PCIE x16 EB.RXBX.2PE1: 1x PCIEx16 + 1x PCIE x4
3 Slots	EB.RXBX.3PC1: 1x PCIE x16 + 1x PCIE x4 + 1x PCI EB.RXBX.3PE1: 1x PCIE x16 + 1x PCIE x4 + 1x PCIE x1 EB.RXBX.3CE1: 2xPCI + 1x PCIE x16
4 Slots	EB.RXBX.4CE1: 2x PCI + 1x PCIEx16 + 1x PCIE x4

电源 Power
Power Input	Fanless:12V~24V，7A~3.5A Faned: 12V~24V，12A~6.5A 电压浮动:最低12V-5%，最高24V +20%
Interface	4Pin Phenix 带锁附接口

环境 Environmental
OperatingTemp	Fanless Operating Temp: 35W CPU -10℃ ~ 45℃(SSD),With 0.7 m/s air flow Fan Operating Temp: 35W CPU -10℃ ~ 60℃(SSD),With 0.7 m/s air flow 35/65W CPU, -10℃ ~ 55℃(SSD),With 0.7 m/s air flow
Storage Temp	-40°C ~ 60°C
Operating Relative Humidity	50℃ 95%RH (35W CPU SSD)
Storage elative Humidity	60℃ 95%RH, Non-Condensing
Random Vibration	5~500Hz, 2Grms（SSD）Operation，5~500Hz, 1Grms（HDD）Operation
Sine Vibration	5~500Hz, 2G Non-Operation
Shock	Operation: 10G@11ms ； Non-Operation: 20G@11ms

机构Mechanical
Housing	Aluminum Alloy
Mounting	Desk-Mount, Wall-Mount
Dimension	229 x 202 x 82 mm 基础型, Basic 229 x 202 x 134 mm 两个扩展槽, 2 Slots 229 x 202 x 156 mm 三个扩展槽, 3 Slots 229 x 202 x 174 mm 四个扩展槽, 4 Slots

认证 Certification
Safety Certification	CCC

销售型号 Sales Model
Sales Model（with Fan)	CIS-XQ67-FW01 CIS-XQ67-FW02 CIS-XQ67-FW03 CIS-XQ67-FW04
Sales Model（without Fan）	CIS-XQ67-LW01 CIS-XQ67-LW02 CIS-XQ67-LW03 CIS-XQ67-LW04